News
Advanced packaging is the next big thing in semiconductors — and no, we’re not talking about boxes
April 19, 2024 | ASU News
ASU is poised to be a major player in the next breakthrough in microchip technology: advanced packaging. The university is one of the few in the country that is teaching advanced packaging to its students, creating the skilled workforce that’s desperately needed by the semiconductor industry.
“ASU’s competitive advantage in advanced packaging stems from our scale, the innovativeness of our faculty and our partnerships, which extend both locally with companies like Deca Technologies, NXP and others, and farther afield,” said Zachary Holman, professor and vice dean for research and innovation.
ASU is at the heart of the state’s revitalized microelectronics industry
April 25, 2024 | ASU News
Arizona now leads the nation in private-sector semiconductor investments, and ASU has been there every step of the way. Fueled by ASU, Arizona has transitioned from an economy based on its historic “5 C’s” to one centered on a sustainable high-tech industry
“Arizona is establishing itself as the epicenter of America’s semiconductor industry, and our universities are key to making that happen,” said Sandra Watson, president and CEO of the Arizona Commerce Authority.
[VIDEO] The packaging play: The future of semiconductor innovation
April 23, 2024 | ASU News YouTube
ASU is at forefront of advanced packaging, the breakthrough microchip technology that combines multiple chips onto a single wafer to make them work faster with powerfully advanced capabilities.
A new Center for Advanced Wafer-Level Packaging Applications and Development, created in collaboration with Deca Technologies, will expand domestic semiconductor manufacturing and drive advancements in artificial intelligence, machine learning, automotive electronics and high-performance computing.
More about ASU microelectronics
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